- Laser ProcessingLaser Materials ProcessingHigh-performance motion and control solutions for improving throughput and precision in laser applications.
- Creating the Perfect Cutting Edge – Making Use of USP LasersCreating the Perfect Cutting Edge – Making Use of USP LasersCreating the perfect cutting edge – making use of the advantages of ultrashort pulse lasers with motion, control, and software solutions for precision and dynamic positioning.
- Keeping On the Right Track – Easy Controlling of Laser & Motion SystemsKeeping On the Right Track – Easy Controlling of Laser & Motion SystemsKeeping on the right track – simple, fast, accurate, and flexible control in laser materials processing for welding and cutting applications.
- Paving the Way for 5G – Fast & Precise Laser Drilling of MicroviasPaving the Way for 5G – Fast & Precise Laser Drilling of MicroviasPaving the way for 5G – enabling high functional density of printed circuit boards with motion control solutions for laser drilling.
- Making the Right Impression – Producing SMD Stencils Using LaserMaking the Right Impression – Producing SMD Stencils Using LaserMaking the right impression – platform and motion control solutions for high-throughput and high-precision laser-based stencil production.
- Creating the Perfect Cutting Edge – Making Use of USP Lasers
- Electronics ManufacturingElectronics ManufacturingMotion and control solutions for fast and precise positioning, processing, and testing of electronic components.
- Paving the Way for 5G – Fast & Precise Laser Drilling of MicroviasPaving the Way for 5G – Fast & Precise Laser Drilling of MicroviasPaving the way for 5G – enabling high functional density of printed circuit boards with motion control solutions for laser drilling.
- Making the Right Impression – Producing SMD Stencils Using LaserMaking the Right Impression – Producing SMD Stencils Using LaserMaking the right impression – platform and motion control solutions for high-throughput and high-precision laser-based stencil production.
- Paving the Way for 5G – Fast & Precise Laser Drilling of Microvias
- Test & InspectionMeasurement, Test & InspectionThe new dimension of quality assurance – flexible positioning solutions for fast and precise measuring and testing procedures.
- Capturing the Scene Perfectly – Motion Simulation for Testing Image QualityCapturing the Scene Perfectly – Motion Simulation for Testing Image QualityCapturing the scene perfectly – motion simulation with hexapods for reliable testing and improving image quality. Discover the advantages and the portfolio of hexapods for motion simulation.
- Ensuring Shape Accuracy – Fast & Precise Analyzing of LensesEnsuring Shape Accuracy – Fast & Precise Analyzing of LensesEnsuring shape accuracy – precision measuring of aspherical lenses – hexapods help to improve precision and speed in the analysis of aspherical lenses.
- Capturing the Scene Perfectly – Motion Simulation for Testing Image Quality
- SemiconductorSemiconductor ManufacturingPI offers motion and control solutions for the highest requirements of mask, wafer, and optics positioning in semiconductor manufacturing
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Making Use of the Advantages of Ultrashort Pulse Lasers.
Glass is indispensable for the modern consumer industry. The transparent material is used mainly for displays on smartphones, tablets, and screens. The demands on glass processing have also increased considerably because of the constant further development and large-scale production of these products. The laser is the tool of choice for cutting thin display glass sheets quickly, precisely, economically, and in the required quantities. However, the characteristic properties of glass are also a challenge for the laser: Glass is brittle, transparent to visible light, has low thermal conductivity and, if heated unevenly, tends to produce stress that can lead to cracks.
So-called ultrashort pulse (USP) lasers can overcome these challenges. The laser pulses in the picosecond and femtosecond range allow strong localization of the energy input and also change the absorption mechanism of transparent materials due to the high photon density. The laser beam focuses on individual points inside the glass and modifies the material along the desired separation line. This change in material allows the glass to crack in a controlled way. USP lasers with high throughput can produce smooth, post-processing-free edges - not only on glass, but also on materials such as sapphire, acrylic, diamond, or ceramic. And the potential is far from exhausted.
Due to its low heat input, micrometer-scale processing accuracy and repeatability, USP technology provides new efficient manufacturing solutions for many industrial applications: For example, for structuring polymer and metal alloys or joining different materials, cutting stents from biopolymers, removing thin anti-reflective and passivation layers from solar cells, or drilling microvias on printed circuit boards.
PI supports laser machine builders, laser system integrators, USP laser manufacturers as well as contract manufacturers worldwide with motion, control and software solutions for precision and dynamic positioning of workpieces, lasers, and laser scanners. For example, through CAD/CAM software including laser and galvo scanner operations, or pre-configured multi-axis systems for simple and fast installation and commissioning. This enables us to help our customers to exploit the potential of USP laser technology and to develop advanced machining processes or product features.
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